Function: It can quickly identify and accurately detect harmful elements such as lead, mercury, chromium, cadmium, and bromine in solder paste, plastic, oil-based pens, packaging materials, etc. It can complete on-site detection and analysis of harmful elements and generate reports.

Testing items: volume, area, height, XY offset, shape
Types of defects detected: missed printing, excessive tin, insufficient tin, continuous tin, offset, shape defects
Minimum detection element: 01005 (imperial)
Accuracy: XY direction<10um; height=0.37um
Repeatability accuracy: height<1um (4sigma)
1200x550mm Detection area (simultaneously load two jobs, automatic detection)
Detection speed: 0.35 seconds/FOV

Function: Use an X-ray inspection instrument to detect the internal structure of the solder joint, confirm whether the solder joint is short circuited, open circuited, or offset.
Are there any voids inside the solder joints, as well as the wetting condition of the solder joints. Function: BOM, coordinates, and drawings can be used for verification to avoid missed inspections;
It can automatically judge the specifications of components and test for multiple stickers, wrong materials, and polarity;
Automatically generate detection reports for easy traceability and restoration of the production quality scene at that time;

Function: It can be used to check against the Bill of Materials (BOM), coordinates, and drawings to avoid missing any inspections.
It can automatically determine the specification values of components, and test for excessive component placement, incorrect materials, and polarity issues.
It can automatically generate inspection reports, which is convenient for tracing back and restoring the quality scenarios during the production at that time.